Zibri of ZiPhone iPhone tool discovered a reference to a future 3G chipset by Infineon called S-GOLD3, after digging around the newly released iPhone SDK Beta 3. The chipset powering today’s iPhone is S-GOLD2 which lacks 3G support, whereas S-GOLD3 features HSDPA category 8 (7.2 Mbps), higher resolution camera up to 5-megapixels, a 2x speed MMC / SD interface, MPEG/H.263 hardware acceleration and video telephony, streaming, recording and playback.

It’s difficult to say whether Apple will take full advantage of Infineon’s S-GOLD3 chipset, but nonetheless, it’s great to know that the next-gen iPhone 2.0 has the potential for 3G and a camera resolution of up to 5-megapixel. As far as video telephony, streaming recording and playback – I could care less for those features.